Market-Leading Equipment for
WAFER LEVEL OPTICS
MANUFACTURING
Enabling 3D / Depth Sensors, Biometric
Authentication and AR/VR Displays
Nanoimprint Lithography, Lens Molding / Stacking,
Wafer Bonding and Metrology
High performance equipment combined with the
EVG NILPhotonics® Competence Center
ensures short time to market
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ISSN 1752-2935 (online)
semiconductorTODAY
COMPOUNDS & ADVANCED SILICON
Vol.15 · Issue 1 · February 2020 www.semiconductor-today.com
VCSELs for 3D sensing
Qorvo buys Custom MMIC & Decawave · Sheffield spins off EpiPix
· Veeco launches Lumina As/P MOCVD platform