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ISSN 1752-2935 (online)
semiconductorTODAY
COMPOUNDS & ADVANCED SILICON
Vol.13 · Issue 10 · December 2018/January 2019 www.semiconductor-today.com
Photonic integrated
circuit project launches
Gallium nitride for
power electronics
IEDM conference
report
Skyworks cuts guidance · Kaiam shutters Scotland plant
TRUMPF acquiring Philips Photonics · Cisco acquiring Luxtera
Lower Cost LEDs
Faster LED Adoption
Another breakthrough from Veeco. This time it’s EPIK.
Introducing Veeco’s new TurboDisc® EPIK700™ GaN MOCVD system
As global consumption for LED general lighting accelerates, manufacturers need bigger, better
MOCVD technology solutions that increase productivity and lower manufacturing costs.
The EPIK700 MOCVD system combines Veeco’s award-winning TurboDisc reactor design with
improved wafer uniformity, increased productivity
ISSN 1752-2935 (online) semiconductorTODAY COMPOU
Lower Cost LEDs Faster LED Adoption Another br
3 contents Editorial
4 editorial Wide-bandgap power sector growing de
6 news Wide-bandgap power semiconductor device m
News: Markets 7 Optical transceiver market grows
8 News: Microelectronics Skyworks cuts December-q
News: Microelectronics 9 Skyworks unveils SkyOne
10 News: Microelectronics SkyWater launches direc
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12 News: Microelectronics MACOM launches first pr
News: Microelectronics 13 Anokiwave's founder & C
14 News: Wide-bandgap electronics Sanan IC announ
News: Wide-bandgap electronics 15 Wolfspeed launc
16 News: Wide-bandgap electronics Transphorm ship
News: Wide-bandgap electronics 17 Portable solar
18 News: Wide-bandgap electronics Further EPC eGa
5 Fuji Electric Lambda Series Safety, Comp
20 News: Wide-bandgap electronics Akash granted F
— Ensure your business is protected from power qu
22 News: Wide-bandgap electronics Compound Semico
News: Wide-bandgap electronics 23 EC approves €1.
24 News: Materials and processing equipment IQE r
News: Materials and processing equipment 25 CS Ap
26 News: Materials and processing equipment Reedh
News: Materials and processing equipment 27 Disco
28 News: Materials and processing equipment ALLOS
News: Materials and processing equipment 29 Riber
30 News: Materials and processing equipment Aixtr
News: Materials and processing equipment 31 LayTe
32 News: Materials and processing equipment ULVAC
34 News: Materials and processing equipment Rigak
News: Materials and processing equipment 35 ISRA
36 News: Materials and processing equipment FBH o
4K Scan Technology
38 News: Materials and processing equipment EVG u
The Mark of Purity. Precision. Performance.
40 News: Materials and processing equipment BluGl
News: Materials and processing equipment 41 C
42 News: LEDs Crystal IS' Klaran UVC LED water di
News: LEDs 43 OSA develops 4W UVC LED water disin
44 News: LEDs Seoul Semiconductor wins all five p
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46 News: LEDs Samsung unveils modular micro-LED d
News: LEDs 47 Nanoco and Plessey partner to shrin
48 News: LEDs China's Hongli Zhuihui and European
Pick your size. The Temescal UEFC-4900–ultimate
50 News: LEDs Osram launches Oslon Black SFH 4736
News: LEDs 51 Osram LEDs and lasers increase safe
52 News: LEDs Osram and GaN Systems introduce ult
News: LEDs 53 Mitsubishi Electric to launch 3W pu
54 News: Optoelectronics SLD Laser launches produ
News: Optoelectronics 55 Kaiam lays off 310 of 33
56 News: Optoelectronics CST Global launches T@CS
News: Optoelectronics 57 CSC, SPTS, Cardiff and S
58 News: Optoelectronics TRUMPF acquiring Philips
News: Optoelectronics 59 II-VI launches red laser
60 News: Optoelectronics OIP4NWE project to creat
News: Optoelectronics 61 EC-funded InPulse indium
62 News: Optical communications Cisco to acquire
64 News: Optical communications NeoPhotonics rais
News: Optical communications 65 AOI sampling 400G
66 News: Optical communications Emcore quarterly
News: Optical communications 67 First Solar expe
68 News: Photovoltaics Alta sets seventh consecut
News: Photovoltaics 69 MehrSi project achieves re
70 News: Photovoltaics Solar Frontier raises thin
News: Photovoltaics 71 Midsummer's record orders
72 Technology focus: Photodetectors Mid-IR AlGaN
Technology focus: Photodetectors 73 extracted a
74 Technology focus: Lasers Quantum dot laser di
Technology focus: Lasers 75 deposition (MOCVD).
76 Technology focus: GaN transistors GaN vertica
Technology focus: GaN transistors 77 tetramethyl
78 Technology focus: Nitride transistors Increas
Technology focus: Nitride transistors 79
80 Technology focus: GaN HEMTs Laser annealing e
Technology focus: GaN HEMTs 81 structures. Patte
82 Technology focus: GaN HEMTs Improving ohmic c
Technology focus: GaN HEMTs 83
84 Market focus: GaN power electronics GaN power
Market focus: GaN power electronics 85 “Nevert
86 Market focus: GaN power electronics Power GaN
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88 Conference report: IEDM High-speed and high-
Conference report: IEDM 89
90 Conference report: IEDM The researchers used
Conference report: IEDM 91 drive current at the
92 Conference report: IEDM
Conference report: IEDM 93 vapor phase epitaxy.
94 Conference report: IEDM
Conference report: IEDM — 2D materials 95 Imec r
96 suppliers' directory Index 1 Bulk crystal so
Suppliers' Directory 97 MARUWA CO LTD 3-83, Minam
98 Suppliers' Directory Praxair Electronics 542 R
Suppliers' Directory 99 SAMCO International Inc 5
100 Suppliers' Directory 14 Chip test equipment
Suppliers' Directory101 Tel: +44 (0)20 7405 8411
102 event calendar If you would like your event l
Event Calendar103 20–22 March 2019 LASER World o
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