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<br /> 应用于化合物半导体工业生产的解决方案<br /> 应用于减薄的和易损的化合物半导体基片的临时键合和键合分离技术<br /> 应用于电解质，厚胶和薄胶以及高台阶的喷涂技术<br /> 应用于器件构图和高级封装的光刻技术<br /> 应用于键合介质层转移和高级封装的晶圆键合技术<br /> <br /> 如需了解更多产品信息以及下载产品手册，敬请登录 www.evgroup.com/compoundsemi<br /> （右上角） ISSN to be assigned<br /> semiconductorTODAY<br /> 面向亚洲中文读者的化合物及先进硅半导体新闻杂志 A S I A<br /> 2015 第 4 卷第 3 期 www.semiconductor-today.com<br /> 亚利桑那州立展示<br /> 了第一支单芯片白<br /> 光激光器<br /> Imec扩大硅上氮化镓的研发倡议，联合研究20毫米外延和E型器件·<br /> Cree将其功率和RF分公司命名为Wolfspeed·AXT收购InP衬底制造商Crystacomm<br /> POET 与 Anadigics 达成VCSEL 制造服务协议·台积电终止了 CIGS 光伏制造<br /> <br /> Lower Cost LEDs<br /> Faster LED Adoption<br /> Another breakthrough from Veeco. This time it’s EPIK.<br /> Introducing Veeco’s new TurboDisc® EPIK700™ GaN MOCVD system<br /> As global consumption for LED general lighting accelerates, manufacturers need bigger, better<br /> MOCVD technology solutions that increase productivity and lower manufacturing<a title="Semiconductor Today Asia 2015 (3) page 1" href="https://secure.viewer.zmags.com/publication/511c23e7?page=1"> 应用于化合物半导体工业生产的解决方案 应用于减薄的和易损的化合物半导体基片的临时键合和键合分离</a> <a title="Semiconductor Today Asia 2015 (3) page 2" href="https://secure.viewer.zmags.com/publication/511c23e7?page=2"> （右上角） ISSN to be assigned semiconductorTODAY 面向亚洲</a> <a title="Semiconductor Today Asia 2015 (3) page 3" href="https://secure.viewer.zmags.com/publication/511c23e7?page=3"> Lower Cost LEDs Faster LED Adoption Another br</a> <a title="Semiconductor Today Asia 2015 (3) page 4" href="https://secure.viewer.zmags.com/publication/511c23e7?page=4"> 3 目录 contents 新闻 News 市场 Markets </a> <a title="Semiconductor Today Asia 2015 (3) page 5" href="https://secure.viewer.zmags.com/publication/511c23e7?page=5"> 4 社论 editorial 欢迎阅读最新一期的《今日半导体亚洲版》 欢迎阅读最新一期的今日</a> <a title="Semiconductor Today Asia 2015 (3) page 6" href="https://secure.viewer.zmags.com/publication/511c23e7?page=6"> 针对高亮度LED 的溅射解决方 案就在这里 想像—下有这样一台溅射设备，它能同时灵活应用于溅镀电流</a> <a title="Semiconductor Today Asia 2015 (3) page 7" href="https://secure.viewer.zmags.com/publication/511c23e7?page=7"> 6 新闻 news QEOS和GlobalFoundries将为毫米波市场提 供一流的CMOS平台</a> <a title="Semiconductor Today Asia 2015 (3) page 8" href="https://secure.viewer.zmags.com/publication/511c23e7?page=8"> 新闻：微电子 News: Microelectronics 7 对于较大直径晶圆的需求将推</a> <a title="Semiconductor Today Asia 2015 (3) page 9" href="https://secure.viewer.zmags.com/publication/511c23e7?page=9"> 8 新闻：宽能隙电子产品 News: Wide-bandgap electronics 英飞</a> <a title="Semiconductor Today Asia 2015 (3) page 10" href="https://secure.viewer.zmags.com/publication/511c23e7?page=10"> 新闻：宽能隙电子产品 News: Wide-bandgap electronics 9 Im</a> <a title="Semiconductor Today Asia 2015 (3) page 11" href="https://secure.viewer.zmags.com/publication/511c23e7?page=11"> 10 新闻：宽能隙电子产品 News: Wide-bandgap electronics C</a> <a title="Semiconductor Today Asia 2015 (3) page 12" href="https://secure.viewer.zmags.com/publication/511c23e7?page=12"> 新闻：宽能隙电子产品 News: Wide-bandgap electronics 11 I</a> <a title="Semiconductor Today Asia 2015 (3) page 13" href="https://secure.viewer.zmags.com/publication/511c23e7?page=13"> 12 新闻：材料与加工设备 News: Materials and processing eq</a> <a title="Semiconductor Today Asia 2015 (3) page 14" href="https://secure.viewer.zmags.com/publication/511c23e7?page=14"> 新闻：LEDs News: LEDs 13 Pick y</a> <a title="Semiconductor Today Asia 2015 (3) page 15" href="https://secure.viewer.zmags.com/publication/511c23e7?page=15"> 14 新闻：材料与加工设备 News: Materials and processing eq</a> <a title="Semiconductor Today Asia 2015 (3) page 16" href="https://secure.viewer.zmags.com/publication/511c23e7?page=16"> 新闻：LEDs News: LEDs 15 ALLOS的150和200mm硅上氮化镓外延技术在</a> <a title="Semiconductor Today Asia 2015 (3) page 17" href="https://secure.viewer.zmags.com/publication/511c23e7?page=17"> 16 新闻：LEDs News: LEDs 首尔半导体大规模生产Wicop发光二极管 韩国</a> <a title="Semiconductor Today Asia 2015 (3) page 18" href="https://secure.viewer.zmags.com/publication/511c23e7?page=18"> 新闻：光电子/光伏 News: Optoelectronics/Photovoltaics 17</a> <a title="Semiconductor Today Asia 2015 (3) page 19" href="https://secure.viewer.zmags.com/publication/511c23e7?page=19"> 18 市场聚焦：功率半导体 如果挑战都克服了，SiC市场将走高而 GaN也将爆炸式增长 Yol</a> <a title="Semiconductor Today Asia 2015 (3) page 20" href="https://secure.viewer.zmags.com/publication/511c23e7?page=20"> 市场聚焦：功率半导体 19 Yole表示, 封装正在成为一个特定 的瓶颈, 但值得庆幸的是,</a> <a title="Semiconductor Today Asia 2015 (3) page 21" href="https://secure.viewer.zmags.com/publication/511c23e7?page=21"> 20 技术聚焦：激光器 亚利桑那州立展示了第一支单芯 片白光激光器 亚利桑那州立大学制作了Z</a> <a title="Semiconductor Today Asia 2015 (3) page 22" href="https://secure.viewer.zmags.com/publication/511c23e7?page=22"> 技术聚焦：激光器 21 在早先意识到这个独特的机会之后, 10多年前Ning的研究团队就开始追求</a> <a title="Semiconductor Today Asia 2015 (3) page 23" href="https://secure.viewer.zmags.com/publication/511c23e7?page=23"> 22 技术聚焦：氮化物工艺 用于氮化镓的化学机械抛光的等 离子体预处理 表面粗糙度降低到1.0</a> <a title="Semiconductor Today Asia 2015 (3) page 24" href="https://secure.viewer.zmags.com/publication/511c23e7?page=24"> 市场聚焦：LED制造 21 </a> <a title="Semiconductor Today Asia 2015 (3) page 25" href="https://secure.viewer.zmags.com/publication/511c23e7?page=25"> 24 技术聚焦：氮化物工艺 减少氮化镓感应耦合等离子刻蚀带 来的损伤 工艺在多量子阱的71nm内</a> <a title="Semiconductor Today Asia 2015 (3) page 26" href="https://secure.viewer.zmags.com/publication/511c23e7?page=26"> 技术聚焦：氮化物工艺 25 图2. (a) AGCLD设计的截面示意图, 激射 方向由页面向外</a> <a title="Semiconductor Today Asia 2015 (3) page 27" href="https://secure.viewer.zmags.com/publication/511c23e7?page=27"> 26 技术聚焦：氮化物工艺 硅掺杂氮化镓的中性pH电化学刻蚀 普通食盐和硝酸钠的解决方案使孔具有</a> <a title="Semiconductor Today Asia 2015 (3) page 28" href="https://secure.viewer.zmags.com/publication/511c23e7?page=28"> 技术聚焦：氮化物工艺 27 在具有不同掺杂</a> <a title="Semiconductor Today Asia 2015 (3) page 29" href="https://secure.viewer.zmags.com/publication/511c23e7?page=29"> 28 技术聚焦：氮化物工艺 p-型氮化镓电化学电位激活 该技术可以选择性地拆散镁-氢配合物，阻</a> <a title="Semiconductor Today Asia 2015 (3) page 30" href="https://secure.viewer.zmags.com/publication/511c23e7?page=30"> 在450nm外延晶片上进 行9V 的EPA 10分钟从 p-GaN层减少的氢含量比 标准退火 (</a> <a title="Semiconductor Today Asia 2015 (3) page 31" href="https://secure.viewer.zmags.com/publication/511c23e7?page=31"> ISSN 1752-2935 (online) semiconductorTODAY COMP</a>