Market-Leading Equipment for
WAFER LEVEL OPTICS
MANUFACTURING
Enabling 3D / Depth Sensors, Biometric
Authentication and AR/VR Displays
Nanoimprint Lithography, Lens Molding / Stacking,
Wafer Bonding and Metrology
High performance equipment combined with the
EVG NILPhotonics® Competence Center
ensures short time to market
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ISSN 1752-2935 (online)
semiconductorTODAY
COMPOUNDS & ADVANCED SILICON
Vol.14 · Issue 10 · December 2019/January 2020 www.semiconductor-today.com
Integrating micro-LEDs
on silicon for displays
SiC wafer supply deals flourish · GaN power chargers at CES
Qromis license for Shin-Etsu · TDK invests in SLD Laser