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ISSN 1752-2935 (online)
semiconductorTODAY
COMPOUNDS & ADVANCED SILICON
Vol.10 · Issue 6 · July/August 2015 www.semiconductor-today.com
VLSI Symposium —
III-V channels on silicon
Developments in
2D materials
Anadigics to make POET's VCSELs·AXT acquires Crystacomm
Seoul Viosys takes over SETi ·TSMC ends CIGS PV production
Lower Cost LEDs
Faster LED Adoption
Another breakthrough from Veeco. This time it’s EPIK.
Introducing Veeco’s new TurboDisc® EPIK700™ GaN MOCVD system
As global consumption for LED general lighting accelerates, manufacturers need bigger, better
MOCVD technology solutions that increase productivity and lower manufacturing costs.
The EPIK700 MOCVD system combines Veeco’s award-winning TurboDisc reactor design with
improved wafer uniformity, increased productivity and reduced operations expenses to ena
ISSN 1752-2935 (online) semiconductorTODAY COMPOU
Lower Cost LEDs Faster LED Adoption Another br
3 contents Editorial
4 editorial Mixing and matching materials On pag
6 news LED prices to stabilize in Q3, before fal
News: Markets 7 Coherent 100G port shipments to g
8 News: Markets Visible light communication marke
10 News: Microelectronics Anadigics' revenue fall
News: Microelectronics 11 forecast that US cable
12 News: Microelectronics Qorvo's quarterly reven
News: Microelectronics 13 Qorvo can do extremely
14 News: Microelectronics Skyworks expands filter
News: Microelectronics 15 MACOM completes divesti
16 News: Microelectronics ST's SiGe BiCMOS chosen
News: Microelectronics 17 RFaxis collaborates wit
18 News: Microelectronics Peregrine expands into
News: Microelectronics 19 IDT extends RF voltage
20 News: Wide-bandgap electronics NASA awards Oza
News: Wide-bandgap electronics 21 GE and SUNY Pol
22 News: Wide-bandgap electronics Rohm adopts lat
News: Wide-bandgap electronics 23 Japan's AIST ad
24 News: Wide-bandgap electronics GaN Systems sig
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26 News: Wide-bandgap electronics Imec extends Ga
28 News: Wide-bandgap electronics Cambridge Elect
News: Wide-bandgap electronics 29 Qorvo to double
30 News: Wide-bandgap electronics Power and Compo
News: Materials and processing equipment 31 EU's
32 News: Materials and processing equipment AXT's
News: Materials and processing equipment 33 Cr
34 News: Materials and processing equipment Veeco
News: Materials and processing equipment 35 V
36 News: Materials and processing equipment Aixtr
News: Materials and processing equipment 37
38 News: Materials and processing equipment Asahi
News: Materials and processing equipment 39 LayTe
40 News: Materials and processing equipment SPTS
News: Materials and processing equipment 41 Oxfor
42 News: Materials and processing equipment Rubic
News: Materials and processing equipment 43 we a
44 News: LEDs Crystal IS launches surface-mount O
News: LEDs 45 RayVio expands UV LED manufacturing
46 News: LEDs Seoul Viosys' acquisition of contro
COMPLETE THIN FILM DEP & ETCH SOLUTIONS
48 News: LEDs Plessey releases range of GaN-on-si
ISSN 1752-2935 (online) semiconductorTODAY COMP
50 News: LEDs Plessey launches LED filaments usin
Pick your size. The Temescal UEFC-4900–ultimate
52 News: LEDs Cree's quarterly LED product revenu
News: LEDs 53 2016 of its Power & RF business. T
54 News: LEDs Osram launches mid-power Oslon Blac
News: LEDs 55 Osram launches sensor for fitness t
56 News: Optoelectronics University of Delaware a
News: Optoelectronics 57 UCLA demonstrates first
58 News: Optical communications II-VI Inc unveils
News: Optical communications 59 JDSU renamed Viav
60 News: Optical communications Oclaro's CFP 100G
News: Optical communications 61 reduce our infra
62 News: Optical communications NeoPhotonics' rev
News: Optical communications 63 that was part of
64 News: Optical communications Emcore reports hi
News: Photovoltaics 65 Soitec ends negotiations t
66 News: Photovoltaics Stion purchases $5.8m of A
News: Photovoltaics 67 TSMC terminating CIGS PV m
68 Technology focus: Photovoltaics Grading galli
Technology focus: Photovoltaics 69
70 Technology focus: Photovoltaics GaInNAs laye
Technology focus: 2D materials 71 Creating heter
72 Technology focus: 2D materials
Technology focus: 2D materials 73 the number of
74 Technology focus: III-Vs-on-silicon Creating
Technology focus: III-Vs-on-silicon 75 The aim
76 Technology focus: Lasers Arizona State demons
Technology focus: Lasers 77 wavelengths in the v
78 Technology focus: LEDs Increasing the power a
Technology focus: LEDs 79
80 Technology focus: LEDs Long-wavelength N-pola
Technology focus: LEDs 81 Table 1. EL characteriz
82 Technology focus: Nitride materials Indium su
Technology focus: Nitride materials 83 were 0.59
84 Technology focus: 2D optoelectronic materials
Technology focus: 2D optoelectronic materials 85
86 Technology focus: 2D transistor materials 2D
Technology focus: 2D transistor materials 87
88 Conference report: VLSI Symposium Getting rea
Conference report: VLSI Symposium 89 The researc
90 Conference report: VLSI Symposium arsenide–an
Conference report: VLSI Symposium 91
92 Conference report: VLSI Symposium Molybdenum d
Conference report: VLSI Symposium 93 `drasticall
94 Technology focus: GaN-on-silicon Metal-insula
Technology focus: GaN-on-silicon 95 with 0.07V s
96 Market focus: Power electronics SiC market to
Market focus: Power electronics 97 at the device
98 suppliers' directory Index 1 Bulk crystal so
Suppliers' Directory 99 MARUWA CO LTD 3-83, Minam
100 Suppliers' Directory Tel: +1 510 793 2559 Fax
Suppliers' Directory101 Praxair Electronics (see
102 Suppliers' Directory 12 Inspectionequipment
Suppliers' Directory103 Semiconductor Technology
104 event calendar If you would like your event
Event Calendar105 27 September – 1 October 2015
ISSN 1752-2935 (online) semiconductorTODAY COMP