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WAFER LEVEL OPTICS
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Enabling 3D / Depth Sensors, Biometric
Authentication and AR/VR Displays
Nanoimprint Lithography, Lens Molding / Stacking,
Wafer Bonding and Metrology
High performance equipment combined with the
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ISSN 1752-2935 (online)
semiconductorTODAY
COMPOUNDS & ADVANCED SILICON
Vol.14 · Issue 3 · April/May 2019 www.semiconductor-today.com
Cree investing $1bn
in SiC materials and
GaN-on-SiC fab capacity
Soitec buying EpiGaN · MACOM forms GaN-on-Si JV for China 5G
First mass-production order for IQE's Newport Mega Foundry