ISSN 1752-2935 (online)
semiconductorTODAY
COMPOUNDS & ADVANCED SILICON
Vol.9 · Issue 6 · July/August 2014 www.semiconductor-today.com
Wafer-level die transfer
for bonding InP to
silicon photonics wafer
High-brightness LEDs
made from perovskite
material
Infineon to buy IR·First Solar's record 21% thin-film cell
Ushio acquiring Oclaro's industrial & consumer unit